PMD flexx2 3D Camera Development Kit
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  • PMD flexx2 3D Camera Development Kit
  • PMD flexx2 3D Camera Development Kit

PMD flexx2 3D Camera Development Kit

PMD flexx2 3D Camera Development Kit

The 3D Camera Development Kit uses high-quality depth data from Infineon's IRS2381C REAL3™ time-of-flight image sensor.

Version DevKit:
Encased, CE Certified, Class 1 Laser Product
Size-71.9 x 19.2 x 10.6mm
Resolution-224x172
ToF Sensor - IRS2381C Infineon® REAL3™ 3D Image Sensor
Illumination-940nm 1 Watt VCSEL (LC1)
Framerate-Up to 60fps (3D frames)
Field-of-View-56 x 44 FOV
Range-0.1m - 4m
Interface-USB3 Type-C
Accuracy: <= 1% of distance (0.5 – 4m @ 5fps) <= 2% of distance (0.1 – 1m @ 45fps)
Software: Royale SDK C/C++ based supports Matlab, OpenCV, ROS 1, ROS 2

Quantity

PMD flexx2 3D Camera Development Kit

Camera Data

ToF-Sensor - IRS2381C Infineon® REAL3™ 3D Image Sensor IC based on pmd ToF Technology
Resolution - HQVGA 224 x 172 pixels (38k)
Measurement Range - 0.1 – 4 m
Depth Resolution - <= 1% of Distance, all Operation Modes
Viewing Angle (H x V) - 56° x 44°
Illumination - 940 nm, VCSEL, Laser Class 1
Sunlight Tolerance - At 100K Lumens (Full Sunlight), loses ~10% max Range vs. Indoors
Framerate - Up to 60fps (3D Frames), 9 pre-defined Modes
Power Consumption - 570mW – 680mW, USB 3.0 compliant
Interface - USB 3.0 (Data & Power)
Data Output - 3D PointCloud and IR Image
Operating Temperature - 0-70 Degrees Celsius

Software Development Kit
Software - Royale SDK (C++ based, supports Matlab, OpenCV,  ROS 1/2), Operating System - Windows 10, Linux/ARM*

Dimensions
71.9 x 19.2 x 10.6 mm
13g (Camera only, without Accesories)

Conformity
CE DIN EN61326-1:2013
RoHS DIN EN63000:2018
Eyesafety IEC60825-1:2014 Laserclass 1

* 32Bit tested on Raspbian GNU/Linux 10 (Buster) Raspberry Pi 3 reference 2020-08-20  64Bit tested on Odroid C2 with Ubuntu Mate 16.04 ARM 64

PMD
flexx2 3D DK
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